Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Tue Apr 23 07:38:27 EDT 2002 | jeremyt
Hi there. I Have a question that hopfully someone on here can answer for me. On a Universial GDM, is there anyway to get all 4 pumps (pistion style) to purge at the same time. The software only allows for one pump at a time. The reason i am trying to
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Fri May 07 17:38:00 EDT 2004 | bruce @ knoll
I will try that next. I did speed up the wave pump motor with a larger pully(20% more speed) This was done at the time to try to increase the size of the wave because I had component leeds touching the wave pot as they passed by. Due to the wave high
Electronics Forum | Fri Jul 11 00:31:31 EDT 2003 | swuicsup
Marcel, Reconfiguring your machine from 80 to 20 stations is quite easy. In the sequencer portion of your machine, it has it's own I/O box. in it, there's the MIT card, location (1). The bit switches are there to inform the controller in the in
Electronics Forum | Fri Oct 24 13:35:11 EDT 2003 | cnotebaert
Ok, I have been trying to purchase a magazine unloader (front of line to load brds into smt equip) from 3 different used equipment manufacturers. I have been hounding them for 4-5 weeks to get me a quote. They all tell me they have them but I have no
Electronics Forum | Thu Mar 04 14:20:41 EST 2004 | Robert
Another question... I use 500gm jars of Kester 256. After a job is complete the used solder is collected and put back into the jar. Generally while a job is run, the jar and used paste could be left out/open for up to 4 hours. A piece of seran wrap i
Electronics Forum | Thu Sep 23 16:23:08 EDT 2004 | russ
Pb free pastes do not wet out like 63/37. Their are no claims from any manufacturers that I am aware of that say it will. Your "little solder balls" are likely caused from oxidization during reflow. What type paste are you using 3,4,5? What are t
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Tue May 17 10:11:54 EDT 2005 | russ
I would use a foam fluxer since spraying rosin will make the stickiest nastiest mess you can imagine. 18 layer board huh? You will want convection preheat, both top and bottom preheaters, preheat tunnel of at least 4-5', a chip wave, laminar flow w
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