Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Sun Feb 24 10:15:41 EST 2008 | teamcanada
Issue cross talk \Stencil thickness recommendation? 3-4-5 mil Using manufactures recommended paste layout Water soluable vs No clean Paste. Any recommended publications? Only one found so far is Fairchild, recommend NC due to potential cleaning issue
Electronics Forum | Thu Oct 16 14:12:36 EDT 2008 | evtimov
Hi, I think the standard was IPC 6850. But I will recommend to go directly with the sigma test. Place parts with the machine and measure the placement accuracy on another machine. 4-5sigma at 50um should be a good machine. If they have sigma in thei
Electronics Forum | Sun Sep 27 22:39:55 EDT 2009 | rajeshwara
The same issue i faced 2 yrs before , i sugest 1. Use stencil of 4 mils ( Take care of Aspect Ratio and Area Ratio ). 2. Use Solder Paste of Type 4.5 and Viscosity in between 1100 to 1300. ( Try Solder Paste of Cookson or Alpha metals : OM338 T45-L
Electronics Forum | Tue May 03 20:01:24 EDT 2011 | city4497s
It a recent occurance and it happen randomly on other area. I'm using senju M705-GRN360-KV and Indium SMQ 90 Leadfree solder paste, we have been using both paste for 4~5 years. We have asked the oven supplier to perform maintenance and inspection, pr
Electronics Forum | Fri Dec 09 06:33:01 EST 2016 | cyber_wolf
Hold on Carlo, You are saying two different things, you are saying "(Zones 3,4,5,7 & even Cooling Zone). PV exceeds about 5-10 degrees with the SP. (ex: SP=140deg, actual PV = 145deg & higher). " Then you say: "the board reach up to 145 deg. 5 deg
Electronics Forum | Fri Dec 09 11:21:52 EST 2016 | ilavu
I have one GSM2 with Flexjet on both beam. I want to replace one beam with Flex head to get more flexibility. My machine is equip with ULC in both front and rear. Also, it is OS/2 with 4.5 software. I do have one working Flex head that can be use. I
Electronics Forum | Tue Jan 16 15:13:51 EST 2018 | ilavu
Hello All, I am in need for "Platform Set-up Validation" (PSV) for my Universal GSM2 with UPS version 4.5. My installation disk for PSV is bad and can not reinstall after hard drive crash.My machine is not register with Universal because some serial
Electronics Forum | Mon Feb 03 16:30:47 EST 2020 | dontfeedphils
Reason I ask is because I've never really paid much attention to the cooling rate, but I'm currently running a 10 zone oven and using all 10 zones for heating whereas I've almost always used a 10 zone as 9 heating and the last as a cooling. I'm curr
Electronics Forum | Tue Apr 27 11:53:36 EDT 2021 | dontfeedphils
When I was looking at Mirtec (4-5 years ago) I wasn't very impressed compared to Koh Young. It was easy to tell that Koh Young started with 3D and then added 2d features where needed, and that Mirtec had done the opposite. There's nothing wrong wit
