Electronics Forum: 4-5 0 (Page 7 of 24)

Mirtec programming discussion

Electronics Forum | Fri Nov 05 10:59:30 EDT 2010 | methos1979

I have had my system for three weeks now. It is an MV3L. It is running version 4.5.0 build 2.1.2 software and it is very stable. I have not had a single crash. We are not a board manufacturer but rather use our system to inspect both populated an

What will happen if a sloder paste is used after 24hours

Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef

We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol

Plating for aluminum wire bonding

Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini

Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards

Dek 265

Electronics Forum | Fri May 12 13:33:27 EDT 2006 | mika

...Ehhhh?? Mark Fick, If the SMT Splice Clips or Kapton tapes does not solve Your DEK-265 motor comms failure problem, maybe try this: The 5 Volts should be within +/- 0.05 V. and if I remember correctly it must Not be under 4.5 V. We have been th

CONTROL OF FLUX DEPOSITION

Electronics Forum | Tue Jun 26 21:41:10 EDT 2007 | davef

4.4 Determine the amount of flux on the board. 4.4.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01 grams. NOTE: Use cardboard with alcohol fluxes to slow their evaporation and get good data. 4.4.2 Weigh the cardboard. 4.4

alignment of prints

Electronics Forum | Wed Nov 15 10:26:54 EST 2000 | Rkevin

I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in

alignment of prints

Electronics Forum | Wed Nov 15 10:24:23 EST 2000 | Rkevin

I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef

I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo

Re: High temperature solder paste for gold plated MCMs

Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan

We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo

Re: Squeegee blades

Electronics Forum | Mon Nov 29 16:17:43 EST 1999 | Curtis T.

Are these blades coated with something like PTFE (teflon)? If so does the coating flake off over time. Incidently I just got a pice quote and they are 4.5X that of our standard MPM nickel plated spring steel, so I wanted to make sure they would last


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