Electronics Forum | Thu Aug 23 00:38:17 EDT 2012 | isd_jwendell
"The problem is we haven’t changed anything in our design, and this has never happened before in 4-5 batches of production." If nothing has changed (same parts, same oven profile, same de-paneling, etc.), could the parts themselves have changed? I h
Electronics Forum | Tue Feb 05 15:01:50 EST 2013 | ercdave1
Thank you for the help and great advise. as of right now I am looking at a 2002 universal GSM2. its running UPS software Level 4.5 Supplement E, and it has updated heads. the machine is sold by PFI of florida. they will install, calibrate on site
Electronics Forum | Fri Jan 25 14:20:31 EST 2013 | jorge_quijano
Hi there, I have a new product today, after reflow oven I've seen a black stain coming from various holes, they can be cleaned with a tissue but some of the contaminant remains inside, we are using Sn63Pb37, the stains are far from soldering areas, t
Electronics Forum | Thu Dec 08 01:44:44 EST 2016 | cmarasigan
We are currently experiencing with our SMD Solder Reflow Equipment on Shooting-Up Zones (Zones 3,4,5,7 & even Cooling Zone). PV exceeds about 5-10 degrees with the SP. (ex: SP=140deg, actual PV = 145deg & higher). Our equipment undergo a monthly prev
Electronics Forum | Wed Aug 22 10:28:19 EDT 2018 | buckcho
I have the same machines, haven't figured it out yet. Only idea i got is to scan every batch and get a rough number of the prints. For example if you have an order of 500 panels, usually it would take 500prints to produce them (maybe 4-5 differences
Electronics Forum | Sun Apr 17 00:04:03 EDT 2022 | klauss
I am mounting 3535 Cree High-power leds with p&p machine. First nozzle picks up the led normally and then it's placed good but after 4-5 times nozzle picks up the led like at an angle. looks like it holds the led from the side edge of the dome.
Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper
Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0
Electronics Forum | Fri Nov 05 10:35:18 EDT 2010 | methos1979
This was a great post from another thread here with some tips: Date: November 04, 2010 07:42 PM Author: eadthem Subject: Who has best desktop AOI ? We do almost exclusively SMT parts but for solder with a 45 degree fillet angle use vertical light
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
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