Electronics Forum | Fri Oct 03 05:40:55 EDT 2003 | kanwal324
please tell the location where your factory is situated or you can go anywhere for the seminar.
Electronics Forum | Tue Feb 07 11:40:55 EST 2023 | tommy_magyar
To me it looks like grounding.
Electronics Forum | Tue Apr 27 13:40:55 EDT 1999 | Corey Peterson
As I transfer prototypes/pilots out of my shop (because the designs are mature or Engineering confidence is high). How do I minimize my risk and ensure success for both the CEM and my group. This would include low tech as well as higher tech boards
Electronics Forum | Tue Mar 09 19:40:55 EST 2004 | Vijay
The shorts happen at corner of the BGA. The PCB thickness is 1.6mm, It is a PC motherboard with all thru hole connectors mounted on.The preheating is done using IR heater and the temp is 120-160 for about 70-80 sec.I am using ERSA IR550A
Electronics Forum | Wed May 14 09:40:55 EDT 2008 | realchunks
Try running the second side first on a board. If it wets well, it points towards your board house. Run a blank board thru your oven and then try your normal process. If you see issues with the first side now - it definitely points towards your boa
Electronics Forum | Fri May 14 14:40:55 EDT 2021 | daisymu
Hi Tom, Thank you very much for your explicit answer. We will try to review the points you shared with us, because I think they can help us. Thank you again
Electronics Forum | Fri Nov 01 17:40:55 EST 2002 | russ
Ken, Is it really possible to load P.T.H., handsolder SMT apply glue or whatever when a board is in a tray? I am trying to get a visual here. I may not understand what types of trays you are talking about. Please contact me offline to discuss. I
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Thu Sep 15 16:40:55 EDT 2016 | zippi
Hello, i have a problem with the Calibaration of my Assembleon Eclipse II. There is a problem with the down Z Position of Head 2. They are 2mm deeper as Head1 by picking up any Componend. Laser High are OK. How Can i setup the Head down High.
Electronics Forum | Tue Feb 08 20:40:55 EST 2022 | joekirin
I have a GPD CF8 that does a good job at this. I believe they may even have an option to count components that have been formed. https://www.youtube.com/watch?v=WHI1aEJ89jw
