Electronics Forum: 402 chip tombstone issue (Page 1 of 3)

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 15:23:27 EST 2001 | davef

I'm with Brian. TIN COATED 0603 FAILURES Welcome to the lead-free generation. ;-) The Eurolanders are so blanking stupid, it just makes my head hurt. But then again, it doesn�t take much. OK, enough pontification. Your profile is setup incorrec

Re: Skewing chip components

Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea

Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais

The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different

Re: ref: tombstoning on chip capacitors

Electronics Forum | Mon Apr 17 21:09:38 EDT 2000 | Bene

Do you know the wetting speed of the solder paste you are using? Ask your vendor for this measurement. I have observed this issue on several products using pastes with wetting speeds faster than 1 second. As stated previously, smaller packages are m

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr

The first issue I see is that you have a high potential of the 402 tombstoning.

Solder Stencil Apertures using NO-Clean Paste and 402's

Electronics Forum | Fri Oct 22 11:37:38 EDT 1999 | Brett Gordon

Working DFM SMT issues with respect to a client's artwork together with a heavily modified solder stencil, I was able to reduce 0402 tombstoning from 80% across the board to 3%. I winged the aperture reductions, but are there any "rules" or guidelin

Re: Tombstoning 0402

Electronics Forum | Tue Dec 26 11:26:00 EST 2000 | acahill

If you have a known problem with the parts, then Reject them back to the Vendor. It appears that you have a solderability issue. As for Tombstoning on 0402 chips, this could trace back to the stencil design and/or machine placement. Define Tombstoni

Tombstoning issues!!!

Electronics Forum | Thu Apr 10 08:23:27 EDT 2008 | scottp

If I read you right the issue is mostly with components from one supplier. I'd suggest looking at the components under a microscope. Also, if you have some old pre-tombstoning parts from this same vendor take close-ups of both and compare them side

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