Electronics Forum | Wed May 06 13:10:56 EDT 1998 | ZULFIQAR H. RIZVI
Dear Freinds, DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DISPEN
Electronics Forum | Sat May 09 11:57:01 EDT 1998 | Bob Willis
How about checking out the Reports on Double Sided Reflow and Pin IN hole Reflow from the SMTA head office. They are both available now so give the SMTA a call !!!! | Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBL
Electronics Forum | Wed May 06 13:44:58 EDT 1998 | Chrys
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Wed May 06 14:37:03 EDT 1998 | ETS, LLC
ETS has a proprietary way of handling this problem. Please contact me offline to discuss. Sincerely, Brian Stumm ETS, LLC 3939 N. Freya St. Spokane, WA 99207 509-483-0900 (voice) 509-483-0331 (fax) ets@eznet.com (e-mail) | Dear Freinds, | DOES ANY ON
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
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