Electronics Forum | Mon Nov 30 21:28:54 EST 2009 | davef
"Environment Friendly Electronics: Lead-free Technology", J Hwang, Electrochemical Publications, 2001 [0901150401], Chapter 6.2, contains a significant amount of data on 58Bi/42Sn that may help you better understand the 58Bi/42Sn solder alloy. We'r
Electronics Forum | Wed Feb 07 17:32:15 EST 2007 | davef
If you can't find bismuth wire, use 42Sn58Bi. For more, look here: http://www.mrs.org/s_mrs/bin.asp?CID=2274&DID=48689&DOC=FILE.PDF
Electronics Forum | Tue Nov 24 10:03:45 EST 2009 | andrzej
Actully none couse we glue them. Please see attached file - there are red dots marking glue placment. I understand you want to check if there is any sense in gluing components. I`ll ask one more time - Is anoyne who reworked SMDs with SAC305 where
Electronics Forum | Thu Nov 19 22:53:53 EST 2009 | davef
Which components are falling off during the second reflow?
Electronics Forum | Tue Nov 24 11:44:12 EST 2009 | mikesewell
I think you're okay reworking with SAC305 but rework with SnPb will result in a SnPbBi alloy with a lowered melting point that may pose reliability concerns. As far as suitability of 58Bi42Sn goes - depends on your requirements.
Electronics Forum | Thu Dec 22 15:36:03 EST 2005 | CC
In general two step temperature reflow process requires minimum 40 deg C delta to be sucessful. We are not using vapor phase soldering but we have similar situation when we change to SAC lead free solder for PCB component population and secondary swe
Electronics Forum | Thu Nov 19 02:22:12 EST 2009 | andrzej
Hi, we have an idea of running one side of PCB using 58Bi/42Sn solder to prevent glueing components on other side of PCB when board is on second run through SMT process. I wonder what issues we can meet once we try to use SAC305 when reworking some
Electronics Forum | Tue Nov 24 10:43:06 EST 2009 | isd_jwendell
I have used SnBi from Alpha, and it worked well. The only issue I found is that you cannot have ANY Pb contamination.
Electronics Forum | Tue Aug 11 19:46:34 EDT 2009 | padawanlinuxero
Guys I have a question since the ever present problem with the crack switch we had to change to a low temp lead free solder paste in these case eutectic 58Bi/42Sn and 57Bi/42Sn/1Ag alloys, now the main question whats diferent between these one and th
Electronics Forum | Mon Jan 11 09:00:17 EST 1999 | Kelvin Chow
Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? Kelvin
