Electronics Forum | Tue Aug 22 16:03:57 EDT 2023 | joeljacobo
Partners, Someone could share with me the user's manual of a Speedline Vectra 450/F machine, I have searched everywhere and I have not been successful, I would be very grateful if someone could share it.
Electronics Forum | Thu Aug 31 01:39:06 EDT 2023 | assuredtech
Hi Jacobo, Did you receive my email? Edward
Electronics Forum | Mon Sep 24 20:33:34 EDT 2001 | davef
Assuming you're seeing this during wave solder, the via acts like a heat pipe conducting 450�F [or whatever] air to your solder balls. Check the fine SMTnet Archives for similar threads and perspective on the direction to take.
Electronics Forum | Tue Jun 03 12:10:42 EDT 2003 | Paul Stolar
I am having a problem remembering what temp to pretin components at. This is for SN63. I thought I used 450F, but this company says 500.
Electronics Forum | Thu Aug 24 01:01:23 EDT 2023 | frankchan
Is this a wave solder oven mate? Can't help with this one but we too are the manufacturer of Reflow & wave solder ovens and else. If related questions we can discuss about it and try to solve.
Electronics Forum | Fri Sep 01 16:50:48 EDT 2023 | joeljacobo
Hi David, No, I have checked and I have nothing in my mailbox, I share it with you: jacobojoelcrm@gmail.com thank you for your help.
Electronics Forum | Fri Feb 04 13:25:31 EST 2000 | DSK
We are using an A.P.E. Sniper Split Vision System and are very happy with it's ease of operation and capabilities. It uses very low velocity air so we have zero problems with parts being blown off the board. Another reason we went with the Sniper
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Wed Jun 04 09:15:06 EDT 2003 | davef
We used to use 260+-5C (500+-10F) for Sn63, now we use 240-260C (460-480 F). You probably could get away with 232C (450F) in all cases, since there is no thermal mass to a lead being tinned. We keep our tinning temperature the same as our solder po
Electronics Forum | Fri Apr 01 17:45:31 EDT 2011 | smt_guy
thanks for all your replies. we tried running our beta runs and have lots of issues. first our molding process which was set to 450'F temp at 1200 PSI smashed the circuit card components and penetrated the epoxy compound we used to encapsulate the C
