Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint
Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont
Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter
Electronics Forum | Fri Apr 29 17:49:22 EDT 2005 | Woodsmt
I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r
Electronics Forum | Fri Apr 29 17:49:26 EDT 2005 | Woodsmt
I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
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