Electronics Forum | Thu Dec 01 20:44:18 EST 2005 | milroyperera
Hi, The temperature in the fridge is 5-10 degrees.
Electronics Forum | Tue Feb 14 01:11:06 EST 2006 | pavel_murtishev
Good morning, Solder paste softeners are designed to allow solder paste reach ambient temperature during shorter time period (only 5-10 minutes instead of hours). You are preparing your material in right way. No reason to worry. BR, Pavel
Electronics Forum | Fri Apr 25 13:30:45 EDT 2008 | flipit
I use Namics 8437-2 for micro BGA and flip chips. Will work for QFN or MLF after soldering. Flows well under gaps as thin as 0.001". Cure in 5-10 min at 150 C. Rock solid product. Is bit expensive. Is from Japan.
Electronics Forum | Fri Nov 21 12:26:47 EST 2008 | karkanov
Hi everyone!! Is anybody have a chart or rule or standard for misprint. What I mean is if there is a way of saying if my print for some reason a switch 1%, 5%, 10%, etc, off the pad that is not acceptable. Thank you Yannick
Electronics Forum | Wed May 29 19:17:17 EDT 2002 | russ
We are starting to see a large increase in the use of through board gold plated connectors that require hand soldering with the limitation of .o6" encroachment up the pin. What is the best way to accomplish this? we currently scrap about 5-10% of t
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Mon Dec 23 13:44:46 EST 2002 | Paul Black
Does anyone have a tried-and-true method to account for machine losses of SMT parts? I remember reading an article once that stated that 5% - 10% of components of certain sizes are known to be lost during placement, and I know some CM's overplan by 5
Electronics Forum | Tue Nov 09 14:21:00 EST 2004 | Dreamsniper
Thanks Russ. When solder paste is applied, you can't see the pads. Because my aperture reduction is 5% - 10% of the pads. Pads are reduced by almost and up to 20% by the PWB Fab and the paste covers the pad. We cal align and inspect but very hard as
Electronics Forum | Tue Jun 28 09:39:00 EDT 2005 | davef
Points to consider are: * Gold plating too thick [SB LT 8 uinches]. [Obviously, we're talking about actual plating thickness, not the specification.] * Reflow recipe improper [SB 220*C 5-10 sec]. A recipe that works fine for HASL needs to be hotter
Electronics Forum | Fri Oct 06 15:43:33 EDT 2006 | Mario Scalzo, SMT CPE
What I usually do is keep the peak temperature about 5-10 deg C below the peak temperature of my lowest rated component, then set everything else up around that. Worse case scenario is to just extend the time above liquidus (TAL) in 5 second increme
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