Electronics Forum | Wed Oct 05 04:32:49 EDT 2016 | piyakorn
Rinse IPA 5 Min --> Treathment/soak IPA50%+SILENT50% 5Min --> Baking 60C/30Min --> Parylene coating (around 8Hr in chamber) --> Found defect spot. We have simulated and ensure board drying before parylene that still have spots. Need help - Thank y
Electronics Forum | Fri Sep 24 05:34:12 EDT 2004 | FengAng
Hi Rob, I don't think you're so right about this thing. In China, there're so many companies that are using the most advanced equipments in the world. Machines using in Europe can also be found in China. In my company, we have the equipments like S
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus
Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma
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