Electronics Forum: 5mils (Page 12 of 35)

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera

Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo

Broken Traces in PCB

Electronics Forum | Mon Aug 12 18:45:31 EDT 2002 | russ

Don't be too sure that it is not your supplier! I have just gone through a similar problem and finally traced it back to PCB design which made the fab not very manufacturable except at a high end shop. What are the specifics of the board? 5mil trace

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M

I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5

HIP defect in BGA

Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan

Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr

Solder balls

Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment

Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F

3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger

Re: Reliability data on pressfit rework/repair.

Electronics Forum | Sat Jan 30 21:55:52 EST 1999 | Kallol Chakraborty

Does anyone have any reliability data /concern on pressfit rework/repair - is there any qualified /characterized equipment /tools present in the industry? What kind of effect does it have on barrel plating quality (1.5mil avg.) after 1 time rework or

Re: Step down stencil

Electronics Forum | Sun Nov 22 10:05:37 EST 1998 | Christopher Lampron

| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Daniel, I do alot of work with Photoetch stencils in Massaschusetts. I do not have the Phone number h

CCGA and overprinting?

Electronics Forum | Mon Oct 15 11:03:24 EDT 2001 | mikecampbell

Dave, Thanks for the info! Yes, I have read the IBM document and realized that I was missinformed about the paste volume. I need 5000 to 5600 cubic mils of paste. Running the numbers I get a 32 mil aperture with a 7 mil step (the rest of the board

Solder mask

Electronics Forum | Wed Dec 12 17:00:14 EST 2001 | mparker

Aw Dave - you guys are so fashionable, are the dark green and red combos seasonal? caramel brown like a Pale Ale? I once heard that the green was chosen because it gives the best color contrast for white silk screens. As for color reflecting or abs


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