Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Fri Nov 09 15:09:42 EST 2007 | mmjm_1099
Hopefully this will help you. I happen to have a few similar problems with PN# MC33982BPNA. I had the stencil made at 6mil thick and had a step-down for 5mil in the problem areas. That seems to take care of the problem we had at the time. ALSO FORGOT
Electronics Forum | Sun Feb 24 10:15:41 EST 2008 | teamcanada
Issue cross talk \Stencil thickness recommendation? 3-4-5 mil Using manufactures recommended paste layout Water soluable vs No clean Paste. Any recommended publications? Only one found so far is Fairchild, recommend NC due to potential cleaning issue
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33
5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc
Electronics Forum | Tue Sep 16 10:51:09 EDT 2008 | rayjr1491
Here is the scenario: We are using Lead Free Type III paste. We are using 5 Mil EFORM stencils The part we are having issues with is a SOT883. Stencil design is the SMALL PADs are 10x16mil Large PAD 14 x 24 mil. We are getting some see-sawing of th
Electronics Forum | Tue Sep 30 14:06:04 EDT 2008 | realchunks
What pitch? You can go 5 mil or even 6 mil stencils depending on your screen printer. Also what do you consider "less solder"? What defect are you having. Remember on a QFP you use the heel filet to determine proper solder joint - not the toe.
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Thu May 13 13:34:15 EDT 2010 | janselmo01
We use Honeywell 3800GHD24E linear scanners for barcodes down to 3.5 mils with no problems (priced under $200). I looked a combo scanners (for 1D and 2D) that can do fine lines, but they are priced over $700. So we use a dedicated 2D scanner where
