Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Tue Mar 08 02:28:03 EST 2011 | nagesh
I have an issue with PLCC Insufficient Heel solder joint fillet.The aperture dimension is : 30 x 100 mils on PCB & on stencil also(1:1 per gerber).Rohs Process. My stencil thickness is 5mils due to presence of Tssop & QFP package & i cannot increase
Electronics Forum | Thu Jun 12 11:11:45 EDT 2014 | emeto
What you need here is a double print process. You should have 5mil stencil for SMT followed by a 10-15mil stencil for TH. I don't know what quantities you are running or do you have the capability to add another printer in the line, but that would be
Electronics Forum | Tue Oct 28 18:58:05 EDT 2014 | rangarajd
You might want to consider using a stepped stencil. We have tried using a 5 mils with an increased aperture size to compensate for the lost solder volume, if you were to use a 6 mils. While the yield was good, we'd still get random opens. With a 6 m
Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto
Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Tue Feb 25 14:39:20 EST 2014 | nicodj77
Stellar Technical Product, we been ordering from them for almost 6 years. My needs where to be used with connectors or power modules on a tray without pick up area (dots) for pick up Fuji nozzle of 5mm. There is no P/N because is a special order, b
Electronics Forum | Thu Mar 03 18:09:06 EST 2005 | gpaelmo
We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might
Electronics Forum | Thu Sep 01 18:27:28 EDT 2005 | Board House
Hi I currently Manufacture product for Dataradio Inc. in Quebec. and would be interested in quoting your product. We are a Multi-layer facility in Minnesota, we currenty manufacture layer counts between 2 & 18 layers. Line widths and Spacing down t
Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil
OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave
