Electronics Forum | Wed Dec 16 19:37:19 EST 1998 | Ron Costa
I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 14
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Wed Nov 15 10:26:54 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Wed Nov 15 10:24:23 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb
I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w
Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea
My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e
Electronics Forum | Wed Mar 29 04:34:14 EST 2000 | Marc
Micheal: Correct me if I am mistaken, but I think you have stumbled onto the age old battle between metric and imperial representations of component packaging. I have to deal with this every day as my machines are metric and the designers use imperia
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
Electronics Forum | Thu Jul 20 17:07:49 EDT 2000 | JACKIE O'ROARK
Hello Bob, I am going to be working with a 5 Mil Flex circuit. There are 2 components to be placed on. I thought of using the conductive glue but after reading your message not recomending it, I am swayed againist it. What is the best way to place
Electronics Forum | Fri Aug 03 15:53:17 EDT 2001 | nwyatt
We have purchased 2 and will be implementing them in our line shortly. We have one for component inspection and one for paste inspection. We are planning on starting with it "dummed down" and then adding more variables and tightening our criteria a
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