Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Sun Nov 21 13:48:16 EST 1999 | Steve Thomas
We're going to 5 mil foil from 6 mil, with a 10 mil aperture, radiused corners. Supposedly going to traps. from right angles, but who knows? We've got temp. controlled at ~73F, but no RH control. We are going to also try out a more humidity toleran
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Wed May 29 17:17:49 EDT 2002 | wilcoxito
As far as aperture dimensions go, I found a technical note written by Micron that recommends using "square apertures with sides equal in length to the diameter of the PCB pad. The corners of the square should also be slightly rounded, and the apertu
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Thu Mar 20 12:04:42 EST 2003 | Ren� Sandoval
Hello Garcia: For my experience in Tombstone problems I recommend you to check the next points: -Use Solder paste with 2% silver -Use 5 mils Th Stencil -In some machines , for 0402 or smaller componentes , you require an special holder for the feed
Electronics Forum | Wed Mar 26 17:09:52 EST 2003 | Jos�
For the Resistor Network Array SMT 0402- 8 pads I'm using a Stencil 5 mils Th. with the next appertures : Corners-biggers pads: 24 x 12 mils Center pads : 9 x 24 mils This Appertures are working excelent for the RN's that his appertures are parallel
Electronics Forum | Tue Apr 01 13:01:27 EST 2003 | cnotebaert
I have NOT done 0402's yet but also have no trouble with 0603's. Did you try any thinner stencils? I don�t know this for a fact just speculating, I would think the 0402's have a smaller brd to chip gap and that you might be able to get away with a 4
Electronics Forum | Fri Feb 20 13:25:00 EST 2004 | russ
Help! i just rec'd my next job from our marketing people and it has a .5mm pitch BGA 8mmX8mm size. Along with this kit came the stencil. So, I have never placed this fine of a BGA before and I am pretty worried about the stencil releasing the past
Electronics Forum | Mon Apr 12 04:56:54 EDT 2004 | qualitel
Hi Eric, Every mounter have a standard count and "release" off the component. The sample and cost saving way is to use the paper (e.g: 4mil,5mil...thick) to measure. Just place on the PCB with supoort base below and release the nozzle step by
