Electronics Forum | Wed Oct 15 15:14:33 EDT 2003 | larryk
You will also find an increase in the costs of the paste
Electronics Forum | Wed Oct 15 17:59:08 EDT 2003 | Gabriele
Wettability also will increase, so it could generate briges on fine pitch leaded component. Gabe
Electronics Forum | Wed Oct 15 08:55:59 EDT 2003 | John
I'm looking at an application that would require 62/36/2 solder paste. We currently run 63/37. I'd like to change across the board to prevent a mix up, but I don't know what concerns/issues that might create. The PCB's we currently run are HASL fi
Electronics Forum | Wed Oct 15 21:42:41 EDT 2003 | adlsmt
I have only used this on Mov assy's, never on boards. If using no-clean does the joint appearance enhance AOI effectivnes? Anyone tried it? The cost would be worth it.
Electronics Forum | Thu Oct 16 18:22:40 EDT 2003 | Gabriele
Russ, you are right, I've seen briging on 16 mils pitch on OSP (ref under N2),to avoid it needs more care in paste volume. Easier was by 63/37 (Clean) and N2 (on OSP double sided PBA). Regards Gabe
Electronics Forum | Wed Oct 15 09:32:51 EDT 2003 | russ
It is a direct switch over from what I have experienced. You don't need to change anything. You should expect to see a shinier/brighter joint. We actually consider them totally interchangeable with no worries about running either on any product.
Electronics Forum | Wed Oct 15 18:18:09 EDT 2003 | russ
Gabe, Interesting, I have never encountered that before. Why would you think we have never seen it? I would think that the increase in wetting would help "pull" the solder onto the leads reducing bridging. Am I wrong? Russ (not a rocket scientis
Electronics Forum | Wed Oct 15 19:11:40 EDT 2003 | dlkearns1
Can also reduce leaching of certain types of components. Also, dont expect to see a "shiny/bright" joint if running Nitrogen in the relfow unit, you'll see a dull/smokey like joint...if running Air then sure,let SHINE! my 2Cents DaveK
Electronics Forum | Wed Nov 23 07:03:28 EST 2005 | davef
Search the fine SMTnet Archives on "lead free component".