Electronics Forum | Tue Sep 09 13:13:38 EDT 2008 | vladig
Silver (Ag). It's a typical composition Regards, Vlad
Electronics Forum | Wed Sep 10 17:12:05 EDT 2008 | vladig
That is exactly what I said. Rarely belongs to Cu or Ni :-) Vlad
Electronics Forum | Tue Sep 09 16:17:45 EDT 2008 | boardhouse
Logannsan, you may want to check into this a little more with your customer to find out what 2 is. It could be as Vlad say's 2Ag -silver, or it could be 2CU -copper or 2Ni- nickel. Also check this form for 62Sn 36Pb 2Ag just my 2 cent. Regards
Electronics Forum | Tue Sep 09 13:03:19 EDT 2008 | logannsan
What is this? I thought 63sn 37pb was the norm. What is with the 2 at the end? Anyone know?
Electronics Forum | Tue Sep 09 16:39:03 EDT 2008 | vladig
As far as I know, they rarely do it with Pb-bassed solders. Pb-free may contain Cu or Ni (to improve test performance) Vlad
Electronics Forum | Wed Sep 10 16:53:46 EDT 2008 | realchunks
Actually it's not rare. I use several pastes from various manufacturers that add 2% silver in their leaded pastes. I would bet it's 2% silver.
Electronics Forum | Wed Sep 10 17:08:08 EDT 2008 | slthomas
Isn't that the non-eutectic one that provides the pasty phase range that people use to clobber their tombstoning problems?
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Wed Sep 10 17:21:08 EDT 2008 | gregoryyork
Strange we use the 179~C eutectic 62/36/2 solder paste as standard in Europe. It is indeed 2% Ag in fact we dont sell 63/37 paste or very rarely. I think if you mix a little 60/40 powder with the 2% Ag alloy this overcomes the tombstoning problem.
Electronics Forum | Tue Aug 14 21:51:29 EDT 2001 | mugen
true.... tata why the elongation% is there.....
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