Electronics Forum: 63/37 kic (Page 1 of 1)

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba

Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of

Re: BGA removal

Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike

| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing

Re: BGA removal

Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga

| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U

Re: BGA removal

Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga

Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon

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