Electronics Forum: 63/37 preform reflow profile (Page 1 of 6)

Voiding Control on AuSn preform reflow process

Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca

I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1

PbF solder paste with 63Sn/37Pb reflow profile

Electronics Forum | Tue Jan 23 16:22:01 EST 2007 | asir

I'm looking for a PbF solder paste with similar characteristic as the 63/37Pb alloy. What alloy composition would you recommend?

PCB's for oven profile testing

Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef

Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R

board delaminated after reflow

Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse

Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What

UBLOX Tim-4A reflow problem

Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby

I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co

Poor reflow over gold plating

Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe

Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our

What caused this reflow issue?

Electronics Forum | Wed Apr 16 11:29:31 EDT 2008 | mmjm_1099

Per Tony SMT Here are more photos: Q15, Q16, Q17 represent good transistors on a 1 up board with the transistor locations that are in question. Q13 is a good transistor on a bad 2up board. Right next to it is Q14 a bad transistor on a bad 2 up boa

Component ( Connector ) drop during secondary reflow

Electronics Forum | Fri Dec 07 06:05:58 EST 2018 | cyber_wolf

63/37 goes from solid to liquid. It melts and solidifies at a single temperature. You can add a percentage of silver and get a slight "pasty range" for a couple seconds. I have never seen a temperature change in a profile keep this from happening w

Can anyone say NOT to use my reflow profile???

Electronics Forum | Wed Apr 21 18:24:13 EDT 2004 | pjohnson@volterra.com

Simple process - we use similar Kester solder brands of "no clean" low residue solder wick to clean our pads, then brush with isopropyl, and apply Kesters brand of tacky flux under a Leica 6x microscope. We do this on 7x7mm and 9x9mm packages. This w

  1 2 3 4 5 6 Next

63/37 preform reflow profile searches for Companies, Equipment, Machines, Suppliers & Information