Electronics Forum | Fri May 18 13:41:34 EDT 2001 | mparker
Good ol' Yankee engineering always says "More is better" You have got to be careful that with more epoxy volume you run the risk of the epoxy merging with solder paste if you are using a glue and paste process. In addition, if the epoxy can spread o
Electronics Forum | Fri Nov 28 04:16:33 EST 2003 | stoney_tsai
Hi, all, I have done an analysis through Statistics on solder volume whose purpose is to identify the required volume for different pitch printing (0.65 or above, 0.50, and 0.40 mm). Finally, came out a regression model. But, I need to evalua
Electronics Forum | Mon Dec 01 15:16:58 EST 2003 | davef
So, you need to know how these reductions in solder volume will perform in real life. In-use of the product in the life environment is the surest test. Many companies can�t wait / don�t want to pay for that information. * Some use accelerated life
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