Electronics Forum | Tue Jun 17 04:46:59 EDT 2008 | fowlerchang
Vacuum baking oven can solve it. At 70 degree and 24 hours. And the vacuum is below than 10pa
Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas
But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's
Electronics Forum | Tue Jun 17 12:57:26 EDT 2008 | sleech
You are correct. For the 70 deg. C drying temperature to be effective, the relative humidity must be as near to zero as possible. A pulling a vacuum on the chamber is an inexprensive and reliable way to accomplish this. Contrary to some claims, our e
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Mon Mar 26 22:42:20 EDT 2007 | sleech
The issue is of drying moisture-sensitive surface-mounted packages is likely to become even more of a baking-headache in light of the upcoming "D" revision to IPC/JEDEC 020. We have taken a simular approach that a major cellular phone firm took in
Electronics Forum | Tue Jan 20 13:33:14 EST 1998 | Justin Medernach
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
| 1 |
