Electronics Forum: 705 (Page 1 of 4)

How much capacitor offset is acceptable?

Electronics Forum | Mon Dec 18 18:27:29 EST 2006 | bigdaddysoy9

This is end overhang: http://workmanship.nasa.gov/lib/insp/2%20books/links/sections/graphics/705/705-24.gif

Shorts in corners of BGA devices

Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John

What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.

Top 5 of No-clean Solder Paste

Electronics Forum | Wed Mar 02 09:19:33 EST 2005 | Indy

we use SENJU M705. type3 solder paste. Has a good shelf life.

Solder Paste Problem (M705)

Electronics Forum | Thu Dec 15 18:53:56 EST 2005 | aswsteven

Hi Guys I am new to SMT Line Currently having a lot of paste problem, have to change every 1.5 day after use. Please advice.

Solder Paste Problem (M705)

Electronics Forum | Thu Dec 15 20:57:53 EST 2005 | Ooi

What u meant by change every 1.5 day ( Expose to enviroment 1.5 day) ?

Solder Paste Problem (M705)

Electronics Forum | Thu Dec 15 21:02:30 EST 2005 | aswsteven

Hi I mean once I open the jar and load into the print machine, paste can use about 1.5 day and start giving a lot of problem. I want to know how long it can be use in print machine.Please advise.

Solder Paste Problem (M705)

Electronics Forum | Fri Dec 16 06:13:31 EST 2005 | trs

Try to get a sample of Indium and give it a try......i happen to think its the greatest stuff since sliced bread!

Solder Paste Problem (M705)

Electronics Forum | Fri Dec 16 07:43:43 EST 2005 | davef

Rob The typical warming or stabilization time for solder paste is four to six hours. Check with your supplier for specific recommendations.

Re: Shorts in corners of BGA devices

Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F

John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the

Re: Shorts in corners of BGA devices

Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis

A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil

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