Electronics Forum | Mon Jun 19 16:13:19 EDT 2000 | Billy
We are going to be getting an ERSA Selective Soldering Machine in shortly, has anyone had any experience with this type of machine? If so, please let me know. Thanks, bw
Electronics Forum | Tue Jun 20 10:12:56 EDT 2000 | ehab
yes, I have two in our facility. They are very good. It's only the time required for programing, some what long. good luck!
Electronics Forum | Tue Jun 20 12:36:49 EDT 2000 | Billy
Thanks, ehab! Was there any special training involved for the programing? Also, how much maintenance and clean up time is required? And, how many different products do you run across the machine? The line we'll be using it on runs quite a variety
Electronics Forum | Wed Jun 21 10:06:19 EDT 2000 | ehab
I believe the training was just a couple days after the installation. It really depends on how many people will be trained and previous machine programming experience. Programming the machine is not that hard; however, it's time consuming sometime.
Electronics Forum | Fri May 23 17:08:53 EDT 2008 | wayne123
I have looked at the JBC irons several months ago, and we will be getting a few of them for the people that do rework all day long, but for the general user around here all they are doing is touch-up and 500 bucks for an Iron for 50 people is a littl
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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