Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Thu Jun 15 13:01:35 EDT 2000 | Dave F
Thank you Michael.
Electronics Forum | Tue Jun 13 21:18:02 EDT 2000 | sachi
is there a site or any information available for double sided reflow? Our compnay is rather new to this proceess and before we get deep i'd like to know more about it.
Electronics Forum | Wed Jun 14 11:22:49 EDT 2000 | Michael Parker
Sachi- To interpret "WASSUP" into something meaningful, you will find all of your questions for Dave by first reading all that you can in this forums archives. Dave is very knowledgable and will mentor you but I suggest you prepare yourself with goo
Electronics Forum | Wed Dec 22 09:56:12 EST 2004 | davef
For BGA: http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=731 For 0402: http://www.xs4all.nl/~tersted/PDF_files/Plexus/tombstoning.pdf
Electronics Forum | Fri Jun 23 10:29:51 EDT 2000 | Bob Willis
Also I suggest you read through the Charity Report I produced on the specifi process of Double Sided Reflow Assembly which you can also get from the SMTA. All the money from the sale of the report goes to the Charles Hutchins Scholarship Fund which T
Electronics Forum | Fri Jun 30 12:21:34 EDT 2017 | davef
James: For IPC Status of Standardization, look here: http://www.ipc.org/Status.aspx dwf: A-610G Final is out for public comment, look here: https://ipc.kavi.com/higherlogic/ws/public/workgroup?wg_abbrev=7-31B
Electronics Forum | Thu Jan 29 16:52:53 EST 2004 | davef
Air Power distributer Pyles caulking guns. One Air Power office is: Air Power, Inc. 107 Woodruff Industrial Lane Greenville, SC 29607 Phone: (864) 234-5456 Toll Free: (888) 731-4836 Fax: (864) 281-0545 Henry Sutherland, Branch Mgr. We have no rela
Electronics Forum | Thu Jul 12 21:58:10 EDT 2007 | davef
Bill 1 Systems for BGA, Flip Chip, CSP and Bump measurement are: * UBM [550 Weddell Dr, Suite 3, Sunnyvale, CA 94089; 800-731-1220 f408-541-0153 contact@ubmusa.com ubmusa.com] ScanView, AutoScan and LaserScan. * Integrated Packaging Assembly; 2221 Ol
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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