Electronics Forum: 775 (Page 1 of 2)

Socket T,LGA 775

Electronics Forum | Wed Aug 04 10:19:51 EDT 2004 | davef

Consider: * Reducing the size of the pads * Reducing the amount of solder paste * Inspecting the print. A print with irregular form (eg, print finishes with a tail, the print is inclined or something like that) * Too long in the reflow zone * Bad ali

Socket T,LGA 775

Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan

The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti

Socket T,LGA 775

Electronics Forum | Sat Jul 31 23:39:53 EDT 2004 | Bryan Sherh

Dears, Is there any LGA775 socket (Tejas) in your products?or process?Here are some issues that I met in my process,need your help and hope it benefits someone. 1.Because the socket body is really very big and weighs about 37g,need special L size No

chemical etching

Electronics Forum | Wed Oct 16 13:16:11 EDT 2002 | davef

Hey Mar, Sounds serious!!! Poke around Buehler, Leco, or Struers Try IPC TM-650 Test Methods Manual: 2.3.6A Etching, Ammonium Persulfate Method - 7/75 2.3.7A Etching, Ferric Chloride Method - 7/75 2.3.7.1A Cupric Chloride Etching Method - 12/94

Re: Package Drop Test

Electronics Forum | Wed Jun 07 08:52:16 EDT 2000 | Dave F

Dreamerperson: Our Quality guy suggested the following: * ASTM D-775 and TAPPI T-802 * ASTM D-3332/Method B * ASTM D-880, D-4003 or TAPPI T-801 Ta

solder balls on high temp.solder

Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec

we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile

smt, rf4

Electronics Forum | Tue May 30 10:18:02 EDT 2000 | moran givon

since I'm new to the subject of printed circuits, I wonder wether some one can explain some fundamental subjects to me: 1. What is FR4? 2. What is SMT? 3. The technology of multi layer printed circuits? 4. What is "Blind and buried vias"? 5. What is

Re: chip shooter

Electronics Forum | Thu Apr 22 14:50:04 EDT 1999 | INTEC

| | I am begining to evaluate hi speed chip shooters. We are interested in the Panasonic MV2E. Does anyone have any experience with the turret style placement equipment, Panisonic in particular. | | Thanks, | | Jeff | | JEFF - I CAN REFER YOU TO A P

warped boarf after reflowing

Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto

Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the

Surface mount Machines Financing

Electronics Forum | Wed Mar 02 18:10:36 EST 2005 | mo8080

Good Afternoon All, Brad I would not be able to help you out on the technical side of your purchase, but If your company is looking for Financing Options I may be of service. My name is Mo Tavackoli and I am with PlainsCapital Leasing. We are a bank

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