Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Electronics Forum | Thu Dec 09 09:51:34 EST 2004 | russ
One of the things that I have found is the "benchtop/lab" type waves (Low cost) do not perform very well except on the simplest of products, they are lacking critical design elements such as adequate preheat length, laminar flow nozzle design, etc.
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Fri Jul 11 10:00:05 EDT 2003 | davef
Component manufacturers recommend limits on the power and period of ultrasonic cleaning. Examples are: * PRECAUTIONS AND GUIDELINES MULTILAYER CERAMIC CAPACITORS: (9) Ultrasonic cleaning time shall be ten minutes maximum. When the power of ultrasoni
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