Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Fri Dec 24 06:20:05 EST 2004 | Steve
Find another component supplier. If you believe that Crap I have some land I wish to get rid of.
Electronics Forum | Wed Dec 29 09:01:14 EST 1999 | Bill
Hi, Justin, As Dave F said in his follow-up, Aerofeed manufactures desiccators of the nitrogen purged type. I'm not sure what your exact requirements or goals are, but I'll be happy to discuss your problem with you if you'll give me a call. We may b
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
| 1 |
