Electronics Forum | Thu Sep 07 10:39:34 EDT 2006 | vicknesh28
Can u elaborate on the bad plating? Have u had any experience on this before? The component has 90/10 Tin lead plating
Electronics Forum | Fri Nov 07 15:57:56 EST 2003 | Marc Simmel
Are there specifications or recommendations for electro-deposited tin-lead plating thickness on austenitic stainless steel that would provide a shelf life of 1 year? 6 months? Would 2 to 3 microns (78 to 118 micro-inches) 90/10 tin-lead over 1.27 mi
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Tue Sep 30 20:05:34 EDT 2003 | afm
Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor to have non-wetted leads? Lead coating is tin lead 90/10. afm
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ
The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.
Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
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