Electronics Forum | Tue Apr 07 14:37:14 EDT 1998 | Chrys
Be careful about the material you choose. All the materials out there are basically glass-filled epoxy composites, but they are different blends with different fillers. Some of them have carbon in the matrix to make them ESD safe, but it also short
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
Electronics Forum | Thu Apr 11 10:17:17 EDT 2013 | ericrr
Some times the PCB manufacture sends PCB panels with bad circuits, there are three ways to make these PCB without placing parts on the bad circuit, Well two in fact plus my method. (1) Placing a light mark on a dark background (or reverse) then the
Electronics Forum | Fri Jan 15 15:06:30 EST 1999 | Earl Moon
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon
| | Hello, | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | So far, the tests I can think of performing, and tha
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall
| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F
Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the
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