Electronics Forum | Fri Nov 04 08:29:13 EST 2005 | davef
There is no relationship between accelerated and actual life tests.
Electronics Forum | Fri Nov 04 10:17:16 EST 2005 | Amol
i though they had a accleration factor as a relationship between ATC and actual life cycles
Electronics Forum | Fri Nov 04 11:07:15 EST 2005 | moonshine
Visit Proof Of Design at http://www.moonmanondarkside.com for free information on this and many other subjects. MoonMan
Electronics Forum | Fri Nov 04 08:10:04 EST 2005 | Amol
Hi all, If i know my field conditions and the required lifespan of the final product, how can i decide what thermal cycle to use for ATC to qualify the product?? I have the JEDEC standards for min-max temps and dwells, but how do i translate them int
Electronics Forum | Fri Nov 04 11:18:34 EST 2005 | patrickbruneel
I agree with Dave 100%, ATC will expose the board and components weaknesses and potential design problems and/or the need for conformal coating. The life span can only be predicted and/or extended by well-documented field failure analyses history and
Electronics Forum | Wed Sep 22 18:23:27 EDT 1999 | Deon Nungaray
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
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