Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure
If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c
Electronics Forum | Mon Nov 11 11:42:26 EST 2002 | MikeF
Like Mark, I'm guessing your problem is with SMT parts on the top side, the solder is re-melting and some of the parts are moving around during when the board is being wave soldered. When I had some training on thru hole wave soldering way back when
Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.
I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te
Electronics Forum | Fri Jan 12 17:33:56 EST 2007 | John S.
I've not seen it on a solder joint, but I've seen it on an SMT pad that had been skipped in a wave solder operation. The boards were under inspection for poor solderability. We never really pinpointed the cause. It would make a perfect 6 pointed s
Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef
Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo
Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Tue Dec 14 11:13:43 EST 1999 | Chris May
Paul, I have (as many have) come across this problem due to misregistration of resist at the PCB fab. You didn't say if these boards are inexpensive double sided or costly multis. I know this shouldn't make a difference on quality but I would tend t
Electronics Forum | Tue Jan 15 12:20:16 EST 2002 | cfraser
This sounds like it could possibly be a case of Black Pad. We have had a few issuses with this in the past as well. Who the PWB vendor? I also recommend searching the archives and doing some solder samples with nonpopulated boards
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
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