Electronics Forum | Fri Jul 03 03:47:59 EDT 1998 | chris Link
| | Has anyone experianced Core Dump errors with their MYDATA TP9? | | My machine (2/96) has 26 million placements and my operators | | have recorded 253 core dumps in 1996, 238 in 1997, and 18 in | | January of 1998. We run one job on the machine,
Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon
| | Hi there, | | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | | | Appreciated for your help. | | rgs, | | chiakl | Chiakl, | It looks like you are speaki
Electronics Forum | Thu Jun 25 08:30:38 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Wed Jun 24 17:07:40 EDT 1998 | Earl Moon
| Hi all, | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process termin
Electronics Forum | Wed Jun 24 16:45:18 EDT 1998 | Bill Schreiber
| I know this topic has probably been talked about before...But I ran into a small situation where Solder Balls were appearing in large quantities on the PCB....the Problem has been isolated and taken care of, my question is, what are some good metho
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Wed Jun 24 13:26:39 EDT 1998 | Brian @ ETS
Dear Upinder, While reading the posts at the SMTnet forum I noticed your post pertaining to Curing ovens for use with Conformal Coatings which require regulated relative humidity to activate the cure. My company, ETS, is the manufacturer of Nordson's
