7 accelerated reliability testing of surface mount solder attachments results

Electronics Forum: accelerated reliability testing of surface mount solder attachments (Page 1 of 1)

Question of delamination in PCB

Electronics Forum | Thu May 07 08:11:58 EDT 2009 | davef

We don't have a good answer for you, but we do have several thoughts on the issue: * First, tin in your solder or solderability protection is going to diffuse into the copper trace or pad on the board naturally. You can stop that by using a protectiv

BGA PCB Pad size

Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef

You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef

There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass

Re: Void in solder bump

Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Re: How long to burn in a circuit board

Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F

Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:

Re: No-Clean Paste Lab Test Evaluations

Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao

Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

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