Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Tue Jan 04 16:20:50 EST 2000 | John
My company is considering purchasing a depaneling press from Pioneer-Dietecs. Our initial evaluation has been very positive; however, in a recent meeting a question was raised about the amount of stress induced in the pcb/components during depanel.
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Tue Mar 30 22:19:02 EST 1999 | dean
| Does any have any reports on competive Component PPM levels for world class manufacturers ?? I would also like to get any information on the fault spectrum for component mounting. | | Generally, it is accepted that world class is below 100 DPMO (
Electronics Forum | Wed Jan 20 13:07:16 EST 1999 | Robert Noory
I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I have
Electronics Forum | Wed Jan 20 20:42:08 EST 1999 | Tony A
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Mon Apr 15 22:37:27 EDT 2002 | davef
Regarding your customer suditor, it would have been nice if you said something like ... Routinely, our testing shall be less than 1.56 microgram/cm^2 NaCl equivalent ionic or ionizable flux residue, according to TM-650, Method 2.3.35 'Detection And
