Electronics Forum: acceptable chloride levels for finished assemblies (Page 1 of 2)

What is the acceptable Halide content of

Electronics Forum | Mon Feb 25 15:09:06 EST 2002 | jax

Kelvin, You can find the Standard acceptable levels and testing procedures from IPC. Here's a little advice from the fellas' over at PCFAB: As a guideline, we recommend that for assemblies processed with low-solids flux technology and that are not cl

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.

My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen

Couple questions for Dave

Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C

| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Plating for aluminum wire bonding

Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef

Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend

warpage for 152mm length PCB

Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef

Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies

Outgoing QC Measurements for Board Operations

Electronics Forum | Tue Oct 21 10:24:54 EDT 2003 | russ

Whoever established the PPM rates should tell you what it is covering (solder joints/assemblies) PPM is nothing more than a ratio. Determining quality levels is really up to you/company and how you want to measure your quality. This can be anything

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam

Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..

Water Soluble for No Clean BGA Balls

Electronics Forum | Tue Apr 13 20:57:14 EDT 2004 | Mike Konrad

Hey Dreamy, Dave is correct. If you attempt to clean your water soluble (OA) flux with water only, you will turn the no-clean flux white. No inspector or end-user will accept this. If a proper cleaning system is not available to you, then I would

Re: Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F

Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce

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