Electronics Forum | Sat Jun 25 00:52:31 EDT 2005 | ktron
Hi all, Recently I had problem with printing the lead free solder paste, almost every board has bridging especially on the fine pitch locations. Anyway this problem never happens when we use leaded solder paste. So I would like to ask if there are a
Electronics Forum | Tue Jul 12 04:31:41 EDT 2005 | Chris Ong
Sorry, I missed out a few point. Is Asahi solder really that popular, even my friends told me that although pricing is higher but able to achieve excellent result. If you have any paste recommendation for my 0402 and 0201 component. Frankly speak
Electronics Forum | Thu Jul 14 10:29:53 EDT 2005 | stepheniii
It can be used as a sales tool. Choose a CPK you want, then "adjust" your definitions and limits untill you achieve that. Just be prepared to explain that someone who is unavailable for explainations set up the SPC system, and you are just following
Electronics Forum | Wed Aug 24 08:57:39 EDT 2005 | stepheniii
Why is your big heavy BGA profile your fastest one? I'm guessing because it's hotter therefor faster? To achieve some kind of "balance" with the others. But you want those boards to get more heat, so you don't blance higher temps with faster belt, yo
Electronics Forum | Wed Sep 07 03:03:35 EDT 2005 | Milroy
I am engaged with SMT production and we are going to have a brand new SMT line and I am studing about the screen printing and I have seen most commonly used stencil thickness is 6mil and I need to know what is the best solder paste height we can achi
Electronics Forum | Wed Oct 12 13:53:03 EDT 2005 | russ
What is nihon solder and which SAC alloy? Try using hot air to preheat the board to about 150C if you can, then try to remove the solder. Sucking pbfree from holes is very difficult since you have to achieve the alloys melting point throughout the
Electronics Forum | Mon Oct 17 17:52:10 EDT 2005 | russ
Lead Free profiles can be achieved on 4 zone ovens on relatively simple boards (I did this for a year). The 4 zones can be a bear to get right for a really optimum profile. Assemblies with significant Delta T designs can be nearly impossible with 4
Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
Electronics Forum | Fri Nov 25 12:01:27 EST 2005 | Sachin Talwadkar
You're right! Whether "Pattern matching" or "Pixel recognition", in both cases, it is the operating person who will make an inference from the results obtained. This makes IPC knowledge the key to AOI usage. "Quality" is never introduced into a pro
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
