Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe
We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha
Electronics Forum | Wed Apr 28 05:58:18 EDT 2021 | ttheis
Hi Deni, Sure, when we begin to run production I will let you know what we are able to achieve. We are planning to begin test production toward the end of the year and have several other processes to setup as well. I have a feeling we might need an
Electronics Forum | Thu Dec 09 14:50:35 EST 2021 | emeto
The question is what exactly are you trying to achieve and at what cost? There is not unique recipe to answer this question, cause we don't know what product is running on this line. Sometimes very short line gives us much more throughput compared to
Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1
I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that
Electronics Forum | Fri Oct 01 04:03:31 EDT 1999 | Brian
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Tue Jun 21 19:25:10 EDT 2005 | darby
This is basically the reply that I had from Heller ovens regading this - "The recommended air flow is at the back of the machine near the vent. From the book I copied from you it should be 500 CFM. If you do not achieve this figure, it not a great
Electronics Forum | Thu Jun 23 21:04:04 EDT 2005 | darby
If you have concluded that it is not a file storage problem you may wish to consider - When setting up a job the camera can move to virtually any position. This does not mean that the actuators on the stencil or board have enough travel to align the
Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef
Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop
Electronics Forum | Wed Feb 23 14:44:28 EST 2000 | Travis Slaughter
Your solder paste manufacturer should determine the time. As far as temperatures those will very with each board. Creating a profile comes down to trial and error, there are some nice tools that help, the MOLE profiler is one, but there are just wa
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
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