Electronics Forum | Fri Dec 15 08:44:17 EST 2000 | DaveJ
I need some advise from the reflow experts. In your experience in nitrogen versus air reflow, what would be the differences in profile parameters? For example, if I profiled a board in nitrogen and achieved (for a particular component) ramps rates un
Electronics Forum | Tue Sep 26 10:04:52 EDT 2000 | Chris May
Darren, You may/will get people referring you to the archives, which is a fair shout. But, by "failure rate" you probably mean "acceptance". What is good and bad depends upon your own acceptance criteria (IPC-610 ?). Find out what the acceptance c
Electronics Forum | Tue Apr 04 06:22:07 EDT 2000 | Neil Stoddart
Help. We are moving to a no clean solder paste and have the following concerns regarding solder balls. What standards are currently being followed concerning solder balls on SMT assemblies? Are these standards realistic and can they be easily achie
Electronics Forum | Wed Feb 23 14:44:28 EST 2000 | Travis Slaughter
Your solder paste manufacturer should determine the time. As far as temperatures those will very with each board. Creating a profile comes down to trial and error, there are some nice tools that help, the MOLE profiler is one, but there are just wa
Electronics Forum | Tue Feb 27 12:43:43 EST 2001 | gsmguru
I've used an on-axis camera lighting for other components with a good deal of success. (But not for CGA's in particular) I would think it should work pretty well for a CGA application. I've done some pretty odd looking parts with this type of lightin
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby
Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea
Electronics Forum | Mon Jun 18 08:25:59 EDT 2001 | Carl Evans
The install of the new closed loop system is totally dependant on which m/c and levell of software you have. the maximum time it should take for a older m/c that has to have new wiring run in the m/c should take no longer than five days including tra
Electronics Forum | Wed Jun 13 16:58:26 EDT 2001 | Ken Lester
Greg; The universal profile concept maybe misleading. the main objective of a reflow system is to reach a certain temperature and maintain it for the required period of time. If your initial profile is set to accomodate this on any board the only va
Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
