Electronics Forum | Tue Aug 10 07:28:49 EDT 1999 | Brian
| | | I am having cleaning problems when processing PCB's which have | | | TAIYO solder mask on them. After processing, hand soldering and | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other
Electronics Forum | Tue Aug 10 15:19:55 EDT 1999 | Earl Moon
| | | | I am having cleaning problems when processing PCB's which have | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc.
Electronics Forum | Tue Aug 10 15:47:34 EDT 1999 | John Thorup
| | | | | I am having cleaning problems when processing PCB's which have | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide mark
Electronics Forum | Tue Aug 10 16:01:12 EDT 1999 | Earl Moon
| | | | | | I am having cleaning problems when processing PCB's which have | | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tid
Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
