Electronics Forum | Wed Sep 21 17:53:19 EDT 2011 | action_101
I would like some input on reworking BGA's and the best method. I have reworked BGA's since 1998 using both micro stencils and just flux dipping the parts. I have reworked SN/PB and lead-free (AIM NC258) BGA's for the last 8 yrs. with just flux. I ha
Electronics Forum | Thu Sep 22 10:27:26 EDT 2011 | action_101
A lot of views and no input??
Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101
The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO
Electronics Forum | Fri Sep 23 16:39:00 EDT 2011 | action_101
The small investemnt of purchasing the IPC-610 manual will pay for itself very quickly. A brief description of the two classes in a few words would be the following: Class II - a well built product with reasonable expectations for both the manufactur
Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101
So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see
Electronics Forum | Mon Sep 26 16:43:18 EDT 2011 | action_101
I am happy that you work in a shop that can build boards right the first time on a consistent basis. Unfortunately, I would say that every place I have been at, we have had a hard time meeting class III standards day in and day out without some kind
Electronics Forum | Thu Sep 29 17:42:49 EDT 2011 | action_101
I used Indium WF-9940 at the last place I was at for 5 years. We ran leaded and lead free product in our ERSAflow selective soldering machine with that flux type. It worked good for both applications. The place I am at now we have an Ersaflow selecti
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Mon Apr 09 21:20:59 EDT 2012 | action_101
Interesting thought. Our paste is 89.2% according to the data sheet I have, but it still might be worth trying the 84-86% syringe blend. Thanks for the suggestion.
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