Electronics Forum | Tue May 29 22:07:42 EDT 2001 | Robert Sykoh
OA stands for Organic Activated. In the good old fo SMT processes, a lot of different fluxes are being considered. RA, RMA, OA, etc. If you look at the present no-clean paste, it is actually RMA.
Electronics Forum | Tue Jun 19 20:42:49 EDT 2001 | davef
So, they want you to talk through a justification for mixing fluxes? That's GREAT, if you can get away with it!!! Tell us more about Safety Clean.
Electronics Forum | Wed Jun 20 11:43:11 EDT 2001 | genny
M.G. Chemicals "Safety Wash Cleaner Degreaser". A primarily ethanol / methyl alcohol product. Part number "405". Brushes, Kim Wipes, or cotton swabs have all been used from time to time to apply it to the PCB.
Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Mon Jul 30 16:32:33 EDT 2001 | LloydG
OA: as in Organic Activated type of Solder paste, meaning the flux vehicle is an organic type. which is actually a water-soluble type. this is the opposite of a NoClean type.
Electronics Forum | Fri Nov 12 17:58:18 EST 1999 | Jason Nipper
I have been actively experimenting with Selective WS pallets fabricated from Delmat. I need feedback from users on life expectancy, demesion constraints relative to warpage or degradation, and any useful info on ways to maximize life and prevention
Electronics Forum | Mon Nov 08 14:18:10 EST 1999 | John Thorup
Reduced Oxide Soldering Activation is an electrochemical method of restoring the solderability of surfaces. Searching the archives of IPC technet and this forum will reveal more details. John Thorup
Electronics Forum | Fri Jun 11 15:43:41 EDT 1999 | wayne sanita
How are you inspecting pcbs post-reflow, are you inspecting all or sampling. The type of assembly involved would be mainly chip components with a mix of actives and a few 25mil and under pitch. If you sample what are your fault rates looking like. T
Electronics Forum | Tue Apr 28 14:03:03 EDT 1998 | Achim
We want to produce BGA�s which will be see burn in conditions of 140�C / 24h active tested. Now we think about problems for the solderball uniformity. Does anybody know about problems or about special solderball alloys for such productsconditions ?
Electronics Forum | Wed Oct 03 05:32:20 EDT 2001 | dwoon
Hi Doug, How about the active placement area? Will the placement area be limited below 27" x 23"? Thanks for your clarification.
