Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Mon Jun 21 18:33:46 EDT 1999 | Deon Nungaray
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Tue Jun 22 10:05:33 EDT 1999 | Chrys Shea
| | We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | | |
Electronics Forum | Tue Jun 22 12:22:34 EDT 1999 | David Spilker
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Thu Dec 04 07:12:00 EST 2003 | ex maintain leader
Hi Mark, I'm ex Fuji smt service engineer, now I'm leading a a team wich repairs pc-boards in Europe. During replacing P4 processor socket I use an old srt-bga rework staion and an mimistencil wich can be placed abowe the bga pads. My 5 Y experience
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Mon Apr 04 08:35:08 EDT 2005 | py (france)
how to replace a qfn on a board , and how to weld it ? special stencil solder cream and as a BGA ?
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Tue Nov 18 15:03:39 EST 2003 | Mark
Yup. I'm attempting a small, but very important experiment. I need to solder several Lead-Free Globtop BGA parts to a Pin-Socket interposer assembly. I'm trying to come up with the best way to do this. I'm thinking of using lead-free solder paste, (b
Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works
