Electronics Forum | Wed Dec 03 07:26:35 EST 2008 | realchunks
Careful on fine pitch QFPs. They will be your weakest joint if your parts are no-lead. And don't think you can simply run a no-lead profile either. Depending on your paste, you cannot simply run your profile in the no-lead temps and expect your fl
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr
Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.
Electronics Forum | Mon Mar 24 00:54:49 EDT 2014 | isd_jwendell
Don't do that! When solder paste dries out, all parts of the flux do not leave. The volatiles leave. Adding new flux messes with the chemistry and %metals and will not perform like new paste. If you can, get your paste in cartridges. It will last lo
Electronics Forum | Mon Mar 25 21:45:22 EDT 2024 | buckeye
I got an inquiry from one of our electronics labs with regards to their soldering processes. They use eutectic (63% Sn, 37% Pb) solder. For liquid flux they are currently using Kester 186, which is an old-school, full rosin (RMA and ROL1) flux that c
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Thu Apr 05 12:25:01 EDT 2001 | davef
Talk about bucking the trend!!! OK, OK, I know some US military work still requires RMA. You�re both correct. Cleaning decisions for RMA fluxed boards are based on customers requirements. [Some do (clean) and some don�t.] Older US military speci
Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
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