Electronics Forum | Mon May 30 09:11:15 EDT 2011 | davef
3a ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity lim
Electronics Forum | Thu Nov 01 22:19:57 EDT 2007 | lvzhu
The solder that we used is kester EM918 and Multicore LS328. Our printer machine is DEK-photon, this machine has supply below 300mm/s. the datasheet solderpaste of speed range is 30 to 150mm/s. when we produce the keyboard of the moble phone, this bo
Electronics Forum | Tue Jan 16 21:27:56 EST 2001 | davef
No we do not use such a storage unit. We say our preferred environment is within: * 30%RH / 84�F * 30%RH / 72�F * 70%RH / 78�F * 70%RH / 68�F J-001C says [words to the effect of]: * At 30%RH and below you�d better make sure your ESD control program
Electronics Forum | Tue Jan 10 16:01:20 EST 2017 | davef
A review document for J-STD-001F with Amendment 1 had the following wording, but you should check the actual document to be sure of correctness 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at le
Electronics Forum | Mon Jun 17 21:16:19 EDT 2002 | davef
You�re correct about J-001. It�s interesting though, I find no references to controlling temperature and humidity as an element of an electrostatic discharge control program in the following: * ANSI/ESD S20-20 * "ESD Program Management" by Ted Dan
Electronics Forum | Wed May 03 20:04:21 EDT 2000 | Dave F
Joe: Hey, just hose everyone down with water when your humidity starts to decrease to below 40%. ;-) Actually, that�s how some humidity controllers work, when added to your heating system. Well basically that�s how they work. I�m not tryin� to
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c
Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry
Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
