Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Fri Sep 24 20:02:39 EDT 2004 | pabloquintana
OK, We have tested and changed several things in our process, but we still getting the same result. We are trying another type of coating. We will see later. My question now is what is adhesion wise acceptable in the industry. I know many of you wi
Electronics Forum | Tue Jan 10 22:10:58 EST 2006 | davef
Muse We don't believe that the IPC TM-650 Test Methods Manual, 2.4.1E, Adhesion, Tape Testing--5/04 [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf ] that you refer to is a "black pad" test. We think it's a method for testing the a
Electronics Forum | Tue Oct 09 11:17:56 EDT 2012 | 18424
Hello All, I have PCB's in a 30 up panel that have signs of improper solder mask adhesion. Per IPC 6012 they specify a maximum of 5 Percent allowed to have problems adhering to base laminate per class 2. I am trying to figure out if this 5% is for th
Electronics Forum | Tue Jan 10 12:53:16 EST 2006 | muse95
There is a tape test from IPC in their TM-650 spec that can be downloaded for free from the ipc website. It will test for gold adhesion to the underlying nickel. Section 2.4.1E, I believe. It is quite simple to perform.
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Thu Aug 06 10:30:41 EDT 1998 | Mike
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
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