Electronics Forum | Thu Sep 01 01:43:12 EDT 2005 | adlsmt
This is a bad situation and if you use (better to rework) adhesive that means it will work worse in your normal process(wont hold). Heat all the leads to reflow temp, twist (rotate)the part untill it breaks free. Most adhesives are not designed for t
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Electronics Forum | Fri Apr 30 11:55:55 EDT 2004 | Chris Lampron
Hello Fredrick, I have used several methods of TC attachment including quick set adheasives (not good at reflow temps as Dave suggests) long set two part epoxies (work well if you have the time to wait for a sufficiant cure) temprobes, tape (kapton
Electronics Forum | Thu Jul 06 07:30:46 EDT 2000 | John
Ralph, Typically our co-op students put down solder paste with a syringe, place the parts on the paste with tweezers, and then reflow the paste with a hot air pencil. This works pretty well when they are hand building prototypes. You can probably
Electronics Forum | Wed Apr 05 22:42:28 EDT 2000 | Dave F
George: I would think so. We use an old Vitronics (822??) IR reflow oven to clue SMT adhesives. Gp get 'em!!! Dave F
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk
We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
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