Electronics Forum | Wed Jun 12 04:02:00 EDT 2019 | liyunqiong
SMT reflow soldering temperature setting and process flow: The influence of SMT reflow process parameters on the key parameters of reflow soldering temperature curve provides reference for the setting and adjustment of reflow soldering process para
Electronics Forum | Fri Feb 14 09:30:00 EST 2003 | blnorman
We currently use Epibond 7275 with MPM printers. Unfortunately we've had problems with Vantico (formerly Ciba) providing a consistent product. Last summer we had extreme difficulty printing due to excessively high adhesive viscosity (20% higher tha
Electronics Forum | Tue Apr 04 02:46:39 EDT 2000 | George Verboven
We are looking for a way to cure conductive adhesive. I heard about curing times from 2 hours and more. But I also received information that curing can be done in 10 minutes at 120 C. Of course it also depends from the type of glue. But the question
Electronics Forum | Fri Jul 20 13:15:15 EDT 2007 | hussman
What? D Wanzek works for Heraus?!?!? Jeez, these f*cking snakes in the grass around this site are just too much. I guess I should've realized it when he started blathering about the product, it's part name, spec and the whole bunch of crap sales
Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
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