Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Electronics Forum | Wed Feb 10 21:41:54 EST 2010 | plaiming
We experiences some failures on PCB assemblies from the field when a methacrylate epoxy adhesive was used to secure some through-hole components to pcb board as reinforcement against vibration. During application, the epoxy covered some smaller SMT c
Electronics Forum | Wed Sep 26 16:33:45 EDT 2001 | davef
Your first inclination is correct. You should start by asking your friends and colleagues on SMTnet: * What is that SMT or MEMS or COB etc.? * What are the considerations when processing a SMT or MEMS or COB etc.? We�re one smart crew that won�t st
Electronics Forum | Tue Jul 11 09:32:54 EDT 2000 | danielm
Our company is in the process of doing a modification to a board that requires running 3 wires. We would like to use tape dots over liquid adhesive because of the ease of removal and no mess. Can someone give me some manufactures of the tape dots? I
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
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